Nithin, S.K., et al., "Dynamic Voltage (IR) Drop Analysis and Design Closure: Issues and Challenges", 11th International Symposium on Quality Electronic Design, 2010, p. 611 - 617.

Smith, Larry D., et al., "Chip-Package Resonance in Core Power Supply Structures for a High Power Microprocessor", Proceedings of the 2001 International Electronic Packaging Technical Conference (IPACK'01).

Zhao, Min, et al, "Hierarchical Analysis of Power Distribution Networks", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 21, Number 2, February, 2002, p. 159-168.